SMARTCOMP 2020
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  • TECHNICAL PROGRAM
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  • WORKSHOP PROGRAM
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  • Panel Speakers
  • Topics
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  • Call For Papers
  • Call For Papers: Industry Track
  • Call For WIP/DEMOS
  • Call For PhD Forum
  • Call For Workshop Proposals
  • ORGANIZING COMMITTEE
  • TECHNICAL PROGRAM COMMITTEE
  • List of Workshops
  • PAPER SUBMISSION GUIDELINES
  • Accepted Papers for the main conference
  • REGISTRATION/Zoom Test
  • Camera-Ready submission
  • IMPORTANT DATES
  • VENUE
  • CONTACT
  • NSF Travel Grant for US Students
  • Home
  • TECHNICAL PROGRAM
  • Presenter Instructions
  • WORKSHOP PROGRAM
  • Invited Speakers
  • Industry Track Invited Speakers
  • Panel Speakers
  • Topics
  • KEYNOTES
  • Call For Papers
  • Call For Papers: Industry Track
  • Call For WIP/DEMOS
  • Call For PhD Forum
  • Call For Workshop Proposals
  • ORGANIZING COMMITTEE
  • TECHNICAL PROGRAM COMMITTEE
  • List of Workshops
  • PAPER SUBMISSION GUIDELINES
  • Accepted Papers for the main conference
  • REGISTRATION/Zoom Test
  • Camera-Ready submission
  • IMPORTANT DATES
  • VENUE
  • CONTACT
  • NSF Travel Grant for US Students
SMARTCOMP 2020

call for WIP/Demos

The 6th IEEE International Conference on Smart Computing (SMARTCOMP 2020) draws upon many application disciplines such as transportation, energy, environmental protection, resource management, healthcare, security, banking, entertainment, and social media. In addition to full-length technical papers, SMARTCOMP welcomes Work in Progress (WIP) papers and technical demonstrations (Demos) showing innovative and original research in the areas of smart computing. Submissions from both industry and academia are strongly encouraged.

WIP papers are expected to report on early or ongoing research activities, while Demo papers are expected to present innovative applications and tools.

The WIP and Demo sessions will provide a forum to discuss novel ideas and emerging results, presenting innovative applications and tools, and bring about novel research questions, approaches, and directions.

Topics:
Submissions should be targeted to one of the following major areas:
  • Smart Cyber-Physical Environments and Energy/Water/Agriculture/Transportation/Healthcare/Banking Infrastructure
  • Security, Privacy, and Economics in Smart Environments
  • Smart Computing Technologies
  • Future Smart Computing Paradigms
  • Smart Human Environments, Health, Entertainment, and Social Activities
  • Smart Energy Management and Analytics
  • Artificial Intelligence and Machine Learning for Smart Computing

Submission Guidelines
  • WIP and Demo papers should be no more than 3 pages in length, including figures, tables, and references.
  • WIP papers are expected to present early or ongoing research activities. Novel approaches and preliminary results are especially appreciated.
  • Demo papers should explicitly state what will be demonstrated to the audience, and how the attendees will be able to interact, enjoy, and experiment.
  • Submitted WIP and Demo papers will be subject to peer reviews by Technical Program Committee members and other experts in the field. All accepted papers will be presented as posters, published in the conference proceedings, and submitted to the IEEE Xplore Digital Library. At least one author of each accepted paper must register and attend the conference to present the work.
  • Authors are requested to submit original, unpublished manuscripts in standard IEEE proceedings format in PDF. Paper submissions should be formatted according to the IEEE conference template. Due to the short interval between the notification of acceptance and the camera-ready deadline, we strongly encourage authors to follow the camera-ready formatting guidelines as close as possible even for the initial abstract submission.
  • Submissions must be made via EDASat.
  • When submitting, please select the “SMARTCOMP 2020: WIP and Demo” track. Then, on the next page, select either WIP or Demo under “Topics”.

Important Dates​
  • Full manuscript due: June 5, 2020 EXTENDED
  • Acceptance notification: June 19, 2020
  • Camera-ready deadline: July 15, 2020
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